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Samsung Unveils Next-Generation Memory Roadmap: HBM5 Aims to Double Performance, zHBM to Boost Up to Eight Times
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Author：小编
During SEMICON Taiwan 2026, Samsung unveiled its latest memory product roadmap, focusing on the introduction of HBM5 and a new zHBM architecture. The HBM5 aims to deliver twice the performance of HBM4E, with a 20% improvement in performance per watt and a 20% reduction in thermal resistance, with mass production expected in 2028. The zHBM architecture targets up to eight times the performance of HBM4E, with a threefold improvement in performance per watt and a 75% to 90% reduction in thermal resistance, expected to be introduced after 2029.
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