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Reports Indicate TSMC's CoWoS Supply Crunch Prompts Customers to Eye Intel's EMIB-T
3 hour ago /
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Author：小编
On September 2, reports surfaced indicating that TSMC's CoWoS (Chip-on-Wafer-on-Substrate) orders have been fully booked until 2027, compelling some customers to endure wait times stretching beyond a year. Amidst TSMC's supply bottleneck, Intel's cutting-edge technology has surfaced as a compelling alternative. MediaTek revealed during a recent earnings conference call its intention to concurrently leverage CoWoS and EMIB-T (Embedded Multi-Die Interconnect Bridge - Thin) technologies for the extensive development of AI ASICs (Application-Specific Integrated Circuits). Furthermore, Broadcom and Meta are contemplating a shift from CoWoS to EMIB to trim costs, while Google and NVIDIA have also expressed keen interest in EMIB-T.
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