The 'K-On-Device AI Semiconductor Technology Development' initiative, spearheaded by South Korea's Ministry of Trade, Industry, and Energy, is slated to unfold from 2026 to 2030, boasting a substantial budget of around 800 billion Korean won. This ambitious project spans multiple application domains and garners the participation of numerous companies. Notably, CoAsia SEMI will join forces with LG Electronics to craft two ultra-low-power IoT chips tailored for LG's AI-driven home products. The project's timeline stretches from July 2026 to December 2030, with an estimated total cost of 31 billion Korean won. LG Electronics will shoulder the responsibility of defining chip specifications and steering the development trajectory, while CoAsia SEMI will take charge of chip design and process optimization, aided by select personnel from its subsidiary, CoAsia NEXELL. The chips will be fabricated by Samsung Electronics. Both entities are poised to capture the upper hand in the next-generation AI home platform arena and venture into untapped markets.