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Huagong Tech's 12-Inch Wafer Laser Equipment Successfully Passes Customer Verification
1 day ago /
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Author：小编
Huagong Tech has independently developed a 12-inch high-end wafer laser processing system, which has now been successfully deployed at a premier enterprise within China's semiconductor sector. This state-of-the-art equipment caters to both front-end and back-end manufacturing processes, supports wafer sizes ranging from 6 to 12 inches, and is distinguished by its 100% domestically sourced core components.
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