The OHT system stands as the logistical backbone of 300mm wafer fabrication facilities. It seamlessly and automatically transports Front Opening Unified Pods (FOUPs) along elevated tracks, handling over 100,000 transfers daily. This system boasts remarkable precision, achieving positioning accuracy within ±1mm, maintaining vibration levels below 0.5G, and upholding cleanliness standards that meet Class 100 requirements. These features directly contribute to the high yield of chips produced through advanced manufacturing processes. At present, domestic manufacturers, including Daoda Intelligence and Xishino, have made significant strides by breaking through key technological barriers. They have achieved high-speed operation at 5.3 meters per second and full-stack localization, thereby expediting the shift away from systems predominantly dominated by Japanese technology. This marks a significant step forward in the localization of semiconductor manufacturing equipment.