On March 13, the GIIC Global Intelligent IoT Consortium, in collaboration with the China Household Electric Appliance Research Institute and leading industry players such as Haier and Midea, jointly released the 'Unified Interconnection Standards for Smart Homes' at the 2026 Appliance & Electronics World Expo (AWE) in China. These standards aim to break down ecological barriers in smart home ecosystems, enabling interoperability among home appliances from different manufacturers and brands. Built upon the 'HarmonyOS Ecosystem Unified Interconnection Standards 2.0,' they integrate open-source HarmonyOS and NearLink technologies. Shanghai HiSilicon, as the core technology supporter, introduced the 'HarmonyOS NearLink Unified Smart Interconnection' solution and conducted a live demonstration. This solution supports password-free network configuration, unified visual management, and AI Agent-driven proactive sensing and services. Recently, the unified interconnection components will be made available in the HiSpark community to drive the industrialization and implementation of these standards.