At the semi-annual performance briefing, Xu Huan, Chairman and General Manager of Bomin Electronics, disclosed that the Chuangxin Intelligent Manufacturing Park (Phase I), Bomin's newly established factory in Meizhou, officially began operations in the first quarter of this year. This facility is dedicated to producing high-end PCBs, including advanced multi-layer and highly reliable HDI boards. Its downstream applications are strategically positioned in cutting-edge sectors such as artificial intelligence, high-speed communications, and intelligent vehicles.

The factory showcases impressive manufacturing capabilities, including the production of 52-layer PCBs with a 30:1 aspect ratio for through-hole technology and 7-step HDI fabrication. With a planned annual production capacity of 360,000 square meters, the factory is currently undergoing a capacity expansion phase, during which product yield rates have been consistently improving.