As the competition in the global semiconductor advanced manufacturing process heats up, several industry behemoths are proactively embracing High NA EUV lithography technology. Notably, both SK Hynix and Samsung Electronics intend to incorporate this technology into DRAM mass production by 2028, making them the first two South Korean memory chip makers to establish a definitive timeline.

Simultaneously, ASML is taking the lead in forging a technology alliance, working hand-in-hand with TSMC, Samsung, and Intel to drive the standardization of the 12-inch photomask ecosystem. SK Hynix, for its part, is currently weighing the option of joining this alliance.

On the other hand, Micron has opted for a distinct approach, giving priority to the utilization of traditional EUV equipment for its 7th-generation 10nm-class DRAM process. High NA EUV technology stands out for its ability to substantially boost lithography resolution and minimize the number of exposures required. Although it entails a 30% uptick in initial equipment investment, it can slash the production cost per chip by 15%, potentially revolutionizing the global memory chip market landscape.