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ASML Senior Vice President Greet Storms shared the latest progress in the mass production of High NA EUV technology at the forum: The model has accumulated over 1.35 million wafer exposures, with 10 devices from 4 customers already in operation and another 3 currently being shipped and installed. The first-generation mass production model, EXE:5200B, has achieved a mass production specification of processing 135 wafers per hour, with plans to increase this to over 180 wafers in the future. Currently, the fleet availability rate is 84%, expected to reach 90% by the end of the year and move towards 93% in the future. Its imaging capabilities can meet the requirements for up to 5 2D DRAM process nodes, potentially reducing the total number of metal layers in the interconnect layers of advanced process chips.
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