At the pre-show forum of SEMICON Taiwan 2026, executives from TSMC highlighted that the demand for AI computing power is experiencing an explosive growth, surging at an annual rate exceeding fivefold. They also projected that the electricity demand for new infrastructure is expected to climb to 30 to 40 gigawatts (GW) per year in the coming years. To capitalize on this burgeoning market opportunity, TSMC plans to harness its cutting-edge logic processes, 3DFabric advanced packaging technology, and silicon photonics technology to propel heterogeneous integration forward. This strategic move aims to cater to the high-performance computing requirements of AI infrastructure.
