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The Beijing Economic-Technological Development Area's Integrated Circuit Core Equipment Project Surpasses Ground Level, Aiming for Main Structure Completion in August
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Author：小编
Recently, the ion implanter scientific research and production conditions construction project at the Beijing Integrated Circuit Core Equipment Innovation Industrial Park in the Beijing Economic-Technological Development Area has surpassed the ground level milestone. The main structure of the project, consisting of two underground floors and covering 15,000 square meters, has completed concrete pouring and has fully entered the construction phase of the above-ground main structure, with the main structure expected to be completed by the end of August.
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