TSMC's Chairman and CEO, C.C. Wei, announced that, based on verification conducted using product-class test vehicles, the performance of devices utilizing the A14 process is now nearing 90% of the intended target. Additionally, the yield for 256Mb SRAM chips has also approached the 90% mark. There is a robust willingness among customers in the smartphone and HPC/AI (High-Performance Computing/Artificial Intelligence) sectors to collaborate, with in-depth technical solution alignment currently in progress.
