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Apple’s A20 Pro Takes Cue from Samsung’s ‘Side-by-Side Packaging’ Approach, Positioning DRAM Adjacent to Enable Direct Chip Attachment to the Vapor Chamber
3 day ago /
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Author：小编
Apple’s forthcoming flagship mobile chip, the A20 Pro, has witnessed notable modifications in its packaging architecture and thermal management pathway, mirroring a design ethos akin to Samsung’s Exynos 2700’s ‘Side-by-Side Packaging’ (SbS) framework. This transformation is perceived as a pivotal sign that the iPhone 18 Pro lineup will experience a considerable enhancement in thermal dissipation efficiency. Although Apple has consistently led the way in the realm of in-house chip development, the packaging and thermal management strategy of the A20 Pro unmistakably borrows from Samsung’s pioneering efforts in mobile processor packaging.
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