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TSMC's Capacity Under Pressure: Marvell and MediaTek Eye Intel's Packaging Tech
2025-11-25 /
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Author：小编
TSMC's advanced CoWoS packaging capacity is still facing significant strain, pushing the semiconductor sector to explore alternative approaches. Lately, Marvell and MediaTek have been weighing the possibility of incorporating Intel's EMIB technology into their ASIC chip designs, a development that has captured considerable attention within the industry. The constraints on TSMC's capacity, combined with the push from U.S. customers for complete supply chain localization and TSMC's not-yet-fully-deployed backend capacity in the U.S., have made Intel's EMIB technology a much-anticipated alternative.
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