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On November 3rd, Dosilicon revealed on an interactive platform that the company is vigorously pushing ahead with the R&D efforts for Wi-Fi 7 wireless communication chips. As the number of connected devices—including smartphones, laptops, IoT (Internet of Things) terminals, and smart home appliances—continues to soar, the market demand for Wi-Fi chipsets is anticipated to surge. This trend not only fuels growth but also imposes stricter requirements on the reliability and transmission speeds of wireless connections. Dosilicon's maiden wireless transmission chip is specifically engineered for high-bandwidth, low-latency environments, effectively addressing the technological needs of smart terminals for swift and reliable wireless connectivity.
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