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Longsys has officially rolled out an integrated packaged mSSD (mini Solid State Drive), marking the successful completion of its development and testing phases. The company has taken proactive steps to safeguard its technological innovation by applying for technical patents on both domestic and international fronts. At present, the product is in the midst of scaling up for mass production.
The mSSD stands out due to its utilization of a specialized packaging process. This process seamlessly integrates the controller chip, storage chip, passive components, and integrated circuits with diverse functions into a single, cohesive package. As a result, it achieves a trifecta of benefits: ensuring reliable electrical connectivity, providing robust physical protection, and facilitating efficient thermal management.
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