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The Shenzhen Municipal Bureau of Industry and Information Technology has recently unveiled the 'Action Plan for Accelerating the High-Quality Development of the Artificial Intelligence Server Industry Chain in Shenzhen (2026-2028)'. This plan outlines a commitment to bolstering research and application efforts for memory chips, expediting advancements in cutting-edge packaging technologies, and prioritizing the development of premium products, including enterprise-grade SSDs and memory modules. Furthermore, it underscores the importance of intensifying R&D in emerging technologies such as near-memory packaging and in-memory computing, aiming to boost the supply capabilities of high-end storage and establish a sophisticated storage product ecosystem tailored for large-scale model training and supercomputing centers.
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