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The issuance of sci-tech innovation bonds has witnessed a continuous upswing this year. Data from Wind reveals that, as of May 24, a total of 760 sci-tech innovation bonds have been issued, amounting to RMB 801.278 billion, significantly outpacing the same period last year. Experts highlight that a confluence of factors, including policy support, cost advantages, and the broadening spectrum of participating entities, have collectively fueled this surge. With the ongoing refinement of supporting mechanisms and a steady increase in the number of participating entities, sci-tech innovation bonds are poised to offer precise support to cutting-edge technology sectors, aiding sci-tech innovation enterprises in overcoming financing hurdles. The potential for future market expansion in this realm remains vast and promising.
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