Suntak Technology has released an announcement addressing abnormal market fluctuations, specifying that for the fiscal year 2025 and the first half of 2026, the revenue generated from the company's AI server-related PCB (Printed Circuit Board) products will constitute no more than 10% of its total revenue, thereby having a limited impact on its overall performance. PTFE-based PCBs, which are the mainstay of its offerings, are predominantly utilized in the communications sector and do not extend into the high-speed server business domain. Furthermore, the company wishes to emphasize that it has no commercial engagements whatsoever with Huawei in relation to the MateXT2 and Kirin 9050Pro chips. Additionally, the SiP (System in Package) and mSAP (modified Semi-Additive Process) package substrates produced by its subsidiary, Proway, do not incorporate advanced packaging processes such as hybrid bonding, TSV (Through-Silicon Via), 2.5D, or 3D packaging.