On September 9th, Kaifa Technology made an announcement revealing that its wholly-owned subsidiary, Piton Technology (Shenzhen) Co., Ltd., has set its sights on further expanding its capabilities in the advanced packaging and testing of memory chips. The entire project will entail a total investment of RMB 1.85 billion. Out of this sum, RMB 1.22 billion is earmarked for the establishment of a brand-new wholly-owned subsidiary and factory. This new facility is projected to enable a monthly capacity of 90,000 units for traditional packaging and testing processes, along with 10,000 units for 2.5D advanced packaging. The remaining RMB 630 million will be dedicated to setting up a research and development line specifically for 2.5D and 3DS advanced packaging technologies. It is anticipated that once production kicks off, there will be a monthly increase of 100 units for each of these two types of advanced packaging.