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On September 8th, sources revealed that Biren Technology (06082.HK) and Shanghai University have recently joined forces to establish the 'Joint Laboratory for Intelligent Integrated Circuit Chips'. Leveraging this collaborative platform, both entities aim to delve into pioneering areas such as optical interconnects for AI chips and innovative cooling technologies. They will engage in joint research endeavors, collectively pursue scientific research projects, and forge a sustainable innovation ecosystem that bridges industry, academia, research, and practical application. Moreover, the partnership will foster university-enterprise cooperation in education, introducing specialized master's and doctoral programs in engineering, along with tailored programs for recent graduates, to nurture top-tier professionals in the integrated circuit sector.
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