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Xiaomi Unveils Xuanjie O100 Chip: Boasting 1.22TB/s Bandwidth, the Pioneer in 6nm 3D Stacked Packaging
1 day ago /
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Author：小编
During Xiaomi's autumn flagship product launch event, Lei Jun introduced the groundbreaking Xuanjie O100 chip to the world. This chip stands out as the first in the world to utilize 6nm 3D wafer-level stacked packaging, coupled with cutting-edge hybrid bonding technology. As a result, it achieves an impressive 1.22TB/s high-bandwidth AI acceleration capability. Compared to traditional smartphones, its memory bandwidth is a staggering 16 times greater, and it boasts a side inference speed of 330TPS. This significant breakthrough underscores Xiaomi's remarkable progress in the chip industry and holds the promise of expediting the widespread adoption of AI technologies across diverse sectors.
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