A research team, headed by Associate Professor Liu Chang of Hunan University and in partnership with several institutions, has introduced the Step-Eva sequential evaporation technique. This innovative method transforms the conventional metal evaporation process into a cyclic one, where about 0.5 nanometers of metal are deposited at a time, interspersed with a 5-minute interval. By employing a time-domain-decoupled relaxation epitaxy mechanism, it facilitates the complete migration and reorganization of metal atoms, resulting in a transformation of metal electrodes from polycrystalline to single-crystalline structures. Transistors constructed using this technology exhibit performance levels that are roughly 100 times greater than those produced by traditional methods, with contact resistance reduced to just one-third of the conventional levels. Furthermore, this technique is versatile, compatible with a range of metals and 2D semiconductor materials, and preserves full conductivity even at ultra-thin layers of just 8 nanometers. Although the research is currently confined to the laboratory, it paves the way for the development of smaller, speedier, and more energy-efficient chips in the future. The team is exploring potential collaborations with industry partners to further equipment development and scale up the process.