The newly disclosed solder point design diagram of Apple's A20 Pro chip reveals that this upcoming processor, earmarked for the iPhone 18 Pro series, is set to undergo several pivotal architectural improvements. These upgrades are primarily aimed at boosting graphics processing prowess and data transfer bandwidth. The A20 Pro is built on TSMC's advanced 2nm manufacturing process and incorporates a 7-core GPU. Graphics performance is projected to see a 28% uplift, even outperforming the M4 chip found in the iPad Pro. Memory bandwidth has been expanded from 64-bit to 96-bit, achieving a total bandwidth of 102GB/s, and is compatible with LPDDR5X memory.

The chip leverages WMCM packaging technology to optimize heat dissipation and minimize data transmission latency. Its CPU maintains a configuration of 2 high-performance cores and 4 energy-efficient cores. Notably, the L2 cache for the energy-efficient cores has been increased to 8MB, while the performance cores retain their 16MB L2 cache. Additionally, the NPU's computational power has been enhanced to 135TOPS, offering robust support for on-device AI applications.