Search
TSMC Executive: Silicon Photonics to Exceed 50% Penetration by 2027, CPO to Enter Mass Production in Second Half of This Year
17 hour ago /
Read about 0 minute
Author：小编
At today's SEMI forum, Hsu Kuo-chin, Deputy General Manager of Advanced Packaging Technology Development at TSMC, stated that silicon photonics technology is gradually becoming the mainstream technology for high-end optical communications, with a projected market penetration rate exceeding 50% by 2027. Meanwhile, as industry validation continues to mature, co-packaged optics (CPO) technology is set to enter mass production in the second half of this year, marking a further establishment of the trend towards transitioning AI data centers from electrical to optical signal transmission.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
