On the evening of July 31, Mingpu Guangci (002902.SZ) unveiled a private placement scheme, suggesting the issuance of A-share stocks to a maximum of 35 targeted investors, with the goal of raising a total amount not exceeding 1.283 billion yuan. Following the deduction of issuance expenses, the proceeds will be earmarked for the High-Speed Optical Module Intelligent Manufacturing Project (788 million yuan), the Industrialization Construction Project for High-Speed Optical Devices and High-End Passive Devices (255 million yuan), the High-Speed Optical Chip Intelligent Manufacturing Project (140 million yuan), and to supplement working capital (100 million yuan). Among these initiatives, the high-speed optical module project stands as the principal investment focus of this private placement, constituting 61.4% of the upper limit of the raised funds. Its objective is to penetrate the core upstream segment of AI computing power by manufacturing high-end, high-speed data communication optical modules, such as 800G/1.6T variants. Furthermore, through the other two projects, the company intends to bridge the capacity shortfall for high-end customized FA products and enhance the back-end capacity for optical chips. It is worth mentioning that Mingpu Guangci has experienced losses for three consecutive years, and this private placement could mark a pivotal move in the company's strategic overhaul.