Media reports indicate that Dinglong Co., Ltd. recently shared insights into its semiconductor material strategy and development progress during an institutional research visit. The company’s focus spans four key areas: wafer photoresists, CMP support materials, advanced packaging materials, and display materials. The high-end KrF/ArF photoresist Qianjiang Phase II production line, boasting an annual capacity of 300 tons, has officially commenced operations, with eight products now securing bulk orders. In total, the company’s product lineup includes over 40 items, with nearly 30 currently undergoing sample verification. Its CMP polishing pads maintain a leading domestic market position, while revenue from polishing slurries and cleaning solutions surged by 63% year-on-year, with June’s monthly sales hitting a record high. In the realm of advanced packaging materials, seven packaging PI material products have been developed, with two already receiving orders; temporary bonding adhesives are also being steadily delivered. For display materials, products such as PSPI and TFE packaging inks have achieved bulk supply for G8.6 high-generation production lines.