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With the relentless progression of semiconductor manufacturing technology, TSMC has spared no effort in propelling its research, development, and strategic planning for the upcoming 1.4-nanometer (A14) chip process, while simultaneously making strides in the 2-nanometer process. In a bid to realize the ambitious goal of mass production by mid-2028, TSMC is set to channel a staggering US$49 billion into the construction of four 1.4-nanometer wafer fabrication facilities. Yet, the sub-nanometer manufacturing realm brings with it unparalleled technical hurdles and construction complexities. To navigate these challenges, TSMC is pioneering the integration of an artificial intelligence (AI) system. This move aims to mitigate construction risks, fine-tune thermal management within the plant premises, and elevate overall operational efficacy.
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