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A research report issued by Guojin Securities indicates that the mSAP process is well-suited for high-precision applications requiring line widths and spacings of less than 15 micrometers. This process presents technical hurdles in areas like base copper treatment, electroplating, and flash etching. Originally employed predominantly in the consumer electronics industry, the mSAP-PCB market is now poised for rapid expansion, fueled by advancements in AI optical modules and NV-CoWoP technology. In terms of the demand generated by mSAP-PCB for upstream materials, it is crucial to focus on areas such as direct writing lithography, electroplating lines, carrier copper foil, chemical solutions, low-CTE (Coefficient of Thermal Expansion) electronic cloth, second-generation low-dk (Dielectric Constant) cloth, and HVLP4 copper foil.
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