TSMC's 2nm chip manufacturing process is set to commence mass production in July 2026, marking a significant departure from Apple's long-held tradition of being the inaugural adopter. Instead, Google will emerge as the first commercial customer. Its in-house developed Tensor G6 chip will be integrated into the Pixel 11 series, which is slated for release on August 12. This series will leverage TSMC's inaugural 2nm N2 process, giving it a market availability edge of roughly one month over Apple's A20, Qualcomm's Snapdragon 8 Elite Gen6, and MediaTek's Dimensity 9600.

The 2nm process incorporates Gate-All-Around (GAA) nanosheet technology, offering a 10%-15% performance boost at equivalent power consumption levels. It also achieves a 25%-30% reduction in power consumption while maintaining the same performance, along with a 15% increase in transistor density.

The Google Pixel 11 series will introduce four distinct models, all featuring 256GB of storage as standard. The starting price will see an approximate increase of €100 compared to its predecessor, primarily attributable to the escalated costs associated with the 2nm chip and enhanced storage capacity.

TSMC's production capacity for the 2nm process is expanding at a rapid pace, with an anticipated monthly output of 140,000 wafers by the end of 2026. This figure is expected to closely approach the peak production levels achieved by the 3nm process in 2025. Furthermore, TSMC has outlined plans to construct four additional 2nm wafer fabrication plants in the United States to cater to the burgeoning demand.