On July 23 local time, Amkor Technology, a U.S.-based semiconductor packaging and testing service provider, announced a multi-year cooperation agreement worth $1.5 billion with NVIDIA to jointly develop advanced semiconductor packaging and testing technologies for next-generation AI and accelerated computing platforms. NVIDIA will provide an upfront payment to support Amkor's expansion of advanced packaging capacity in the United States. The two sides will align their technology roadmaps in areas such as high-density interconnects and next-generation heterogeneous integration. Amkor has previously provided advanced packaging services for NVIDIA's data center processors and other products. This cooperation will accelerate the construction of Amkor's packaging campus in Arizona, which has a total investment of $7 billion and is expected to commence operations in 2028, with Apple and NVIDIA already secured as key customers.