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Heavyweight Release | Guangyu Xinchen Unveils the World's First On-Device High-Computing-Power 3D Near-Memory Computing AI Chip TC1000 Series
4 day ago /
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Author：小编
On July 17, Guangyu Xinchen unveiled the world's first on-device high-computing-power 3D stacked near-memory computing low-power large model inference chip, the TC1000 series, at the 2026 World Artificial Intelligence Conference. The chip adopts a self-developed 3D stacked near-memory computing architecture, breaking through the 'memory wall' issue and achieving a 10-fold increase in equivalent bandwidth. Under the same computing power, its power consumption is only 1/3 of traditional solutions, supporting high-performance operation of large models with a scale of 35B, filling the domestic gap in this field.
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