During institutional research visits, Luxshare Precision disclosed that within the realm of thermal management products, the company has established a comprehensive product system to cater to the burgeoning demands of the AI sector. This achievement was realized through strategic mergers and acquisitions, as well as the assembly of top-tier R&D teams. Presently, the industry trend in heat dissipation is undergoing a transformation, shifting from traditional fan cooling methods to more advanced liquid cooling techniques. Liquid cooling encompasses a diverse array of approaches, including cold plate cooling, two-phase cooling, spray cooling, and immersion cooling. Notably, the microchannel technology that Luxshare Precision embarked on developing two years ago is poised to enter mass production in the upcoming year. Furthermore, the diamond copper material that the company has been pre-researching demonstrates exceptional thermal conductivity, surpassing that of ordinary copper. Its thermal expansion coefficient aligns closely with that of silicon, thereby significantly mitigating thermal resistance. The company's R&D team stands at the forefront of the industry in terms of simulation capabilities, with the disparity between actual measurements and simulation results being meticulously controlled within a margin of ±1 degree.