According to data from Tianyancha, Xi'an ESWIN Material Technology Co., Ltd. has recently been granted an invention patent. The patent, named "Detection and Control Method, Apparatus, Control Device, Program Product, and Medium for Silicon Wafers," boasts the authorization announcement number CN119694918B. The authorization was officially announced on October 17, 2025, following the application submission on December 12, 2024.

The technical approach outlined in this patent works as follows: When a carrier bearing one or more silicon wafers reaches the loading port of the detection equipment, the system checks whether the detection criteria are satisfied based on the silicon wafer information linked to any abnormal unloading ports. If the criteria are met, the detection process is initiated, and the results are recorded. Subsequently, the silicon wafers are processed according to these results. This innovative solution facilitates the automated handling of abnormal silicon wafers, thereby eliminating the inefficiencies associated with manual sorting.