On August 31st, at an institutional research event held on the same day, Feiling Kesi addressed inquiries regarding 'whether the company is deploying super node products.' The company explained that super nodes represent a novel infrastructure in the AI landscape, designed to facilitate the interconnection of high-density computing chips—comprising one or multiple elements such as CPUs, GPUs, NPUs, DPUs, along with memory and external storage—via specialized switches optimized for high-speed AI networking. This setup allows for resource aggregation and collaborative operations on an equal footing, thereby constructing a cabinet-level, tightly-integrated computing unit. This unit features logically unified memory semantics and an all-in-one infrastructure. Looking ahead, Feiling Kesi will persistently track the latest technological advancements and growth prospects within the industry, capitalizing on its inherent strengths to broaden its portfolio of related businesses and products, thereby aligning with market and customer expectations.