Search
Honor officially announced that the Honor Magic Grand Ceremony and Honor Magic9 Series New Product Launch Event will be held in Beijing on September 28th. At the event, the appearance of the Magic9 Pro Max will be unveiled. This device is jointly developed with Arri and features a rear-mounted 200MP, 1/1.4-inch sensor periscope telephoto lens with OIS anti-shake support. The Magic9 series will be among the first to be equipped with the Snapdragon 2nm flagship chip and will include multiple models, among which the 'Super Power Edition' may come with an internal active cooling fan. The entire series will be equipped with a dual 200-megapixel imaging system, with a main camera featuring a 200MP, 1/1.28-inch sensor and a periscope telephoto lens featuring a 200MP, 1/1.4-inch sensor. Additionally, a blogger has leaked the appearance image of the Magic9 Pro Max.
-
C114 Communication Network -
Communication Home
