As the release date of Google's Pixel 11 series draws near, more evidence has surfaced indicating significant changes to its core hardware. Based on recently revealed FCC certification filings, the series is set to undergo a major transformation in its communication hardware setup: it will entirely move away from Samsung Exynos modems, which have been a staple since the introduction of the first-generation Tensor chip, and will switch to MediaTek's offerings instead. Google has officially declared that it will host the Made By Google event in New York at 6:00 PM Eastern Time on August 12, 2026, where the Pixel 11 series will be officially launched. Reports indicate that the Pixel 11 series will phase out the 128GB storage option entirely, with all models starting at a minimum of 256GB. Moreover, the Pro, Pro XL, and Pro Fold variants will also offer a 1TB storage option. This move is aimed at catering to the increased storage needs in the AI era, ensuring seamless performance for the deployment of large on-device AI models. Furthermore, the Pixel 11 series will be equipped with Google's in-house developed second-generation Tensor G6 chip, fabricated using TSMC's cutting-edge 2nm process. It will also incorporate the Titan M3 security chip and bring across-the-board improvements in camera hardware, display specifications, and other key areas.