Recently, rumors have been swirling in the market. It is said that although Qualcomm's latest flagship mobile platform, the Snapdragon 8 Elite Extreme Gen 6, stands out as the industry's pioneer in adopting TSMC's 2nm process, this new process hasn't entirely put an end to overheating problems during extended high-load operations. During Samsung's internal testing of the processor, notable performance degradation was detected, prompting the company to feedback to Qualcomm with requests for enhancements. To tackle the heat dissipation issue, Qualcomm had introduced Offset PoP packaging technology. However, tests revealed that even with this technology, forced frequency reductions still took place once the temperature surpassed the limit during prolonged high-load tasks, which in turn affected the sustained performance output. Interestingly, initial testing conducted a few weeks ago indicated a marked improvement in the chip's sustained performance. It managed to maintain a temperature threshold of 105 degrees Celsius for over 15 minutes, a significant leap from the mere 6 minutes and 30 seconds achieved by its predecessor. Yet, it's worth noting that the new packaging solution hasn't completely eliminated heat dissipation issues under sustained high loads. In response, Qualcomm's Chief Marketing Officer clarified that the Snapdragon 8 Elite Gen 6 does not suffer from systemic heat dissipation problems. He also mentioned that it is a common practice for mobile phone manufacturers to fine-tune the platform during the development phase prior to the product's official release.