On September 11, during its 2026 semi-annual performance briefing, Tansotech highlighted that as the density of AI computing power escalates, the challenges associated with heat dissipation and thermal management become increasingly formidable, particularly when advanced packaging technologies achieve higher levels of integration. Leveraging its exceptional properties, such as high thermal conductivity and resistance to elevated temperatures, silicon carbide has emerged as a pivotal material in the realm of heat dissipation and interposers for advanced packaging solutions. This material not only enhances thermal conduction efficiency but also bolsters system stability under conditions of high power density. Furthermore, certain solutions incorporating silicon carbide can adeptly balance the demands of integration density with the optimization of packaging forms. Tansotech has proactively established strategic layouts in these cutting-edge domains, including advanced packaging heat dissipation interposers, and is actively fostering collaborative partnerships with clients to jointly advance related initiatives.