From September 9 to 11, 3PEAK made a notable appearance at the 27th China International Optoelectronic Exposition on September 10. During the event, the company showcased its cutting-edge analog and mixed-signal chip solutions tailored specifically for the optical communication sector. The exhibits featured a diverse range of products, including 800G and 1.6T pluggable high-speed optical module solutions that are compatible with both silicon photonics and EML dual-technology routes. Additionally, 3PEAK presented CPO and NPO co-packaged optics solutions, which are ready for mass production and support ELSFP external light sources. The company also displayed its OCS all-optical switching complete control solutions, as well as full-link solutions for coherent optical modules and EDFA optical amplification.

Among these innovative offerings, 3PEAK's two comprehensive solutions for the next generation of high-density optoelectronic integration technology—CPO and NPO co-packaged optics, along with ELSFP external light source—have successfully passed customer verification. This achievement not only effectively shortens the product development cycles for customers but also accelerates the time-to-market for their products.