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Kaifa Technology Intends to Invest 1.85 Billion Yuan in Boosting Capacity for Advanced Memory Chip Packaging and Testing, With an Emphasis on 2.5D/3DS Advanced Packaging
8 hour ago /
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Author：小编
On September 10, 2026, Kaifa Technology made an announcement that its wholly-owned subsidiary, Shenzhen Apt Electronics Co., Ltd., is set to invest a substantial sum of 1.85 billion yuan in a project aimed at expanding its capacity for advanced memory chip packaging and testing. This investment will cover the construction of a brand-new factory and the setup of a 2.5D/3DS advanced packaging research and development line. The project is anticipated to reach completion by December 2028. It's worth noting that this project does not necessitate shareholder approval, nor does it involve a related-party transaction or a significant asset restructuring, in line with common business practices and regulatory requirements.
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