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ChangXin Memory Technologies (CXMT) is currently grappling with yield-related setbacks in its pursuit of High Bandwidth Memory (HBM) research and development. Drawing on reports from technology news platform WCCFtech and insights from the South Korean industry, CXMT has run into process bottlenecks during the trial manufacturing of 8-layer stacked HBM3 memory chips, which are intended for use in artificial intelligence computing chips. The overall yield rate has been disappointingly low, hovering between just 25% and 30%. When factoring in the final stages of packaging, testing, and performance evaluations, a staggering nearly 80% of these chips have fallen short of the required standards, presenting substantial obstacles to achieving meaningful production volumes.
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