On September 8th, Qualcomm unveiled a multi-generational collaboration pact with Amazon, with the shared goal of delivering tailored chips for expansive AI data centers and collectively propelling AI inference technology forward. Beyond this, the duo will also embark on the joint development of optical interconnect solutions, reaching speeds of up to 1.6T and beyond in future iterations. Qualcomm intends to leverage AWS's AI infrastructure (encompassing Amazon Bedrock) for electronic design automation (EDA) tasks, thereby streamlining chip design timelines. Cristiano Amon, President and CEO of Qualcomm, remarked that amidst the burgeoning demand for AI, data center infrastructure necessitates significant advancements in both computing prowess and connectivity. Qualcomm is thrilled to partner with AWS in crafting customized chips and connectivity solutions. Prasad Kalyanaraman, Vice President of AWS, highlighted that this collaboration is built upon a robust partnership, aiming to furnish customers with infrastructure that is both more efficient and cost-effective.