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Recently, Xiamen Silan Jihua’s 12-inch high-end analog integrated circuit project has achieved significant milestones. The basement and foundation slab construction have been fully completed, and work has commenced on the primary structures of the main factory building in the southern section, along with the power and support facilities in the northern section. The project is expected to reach structural completion (or "top out") by the end of December, with delivery scheduled for May 2027 and operational launch in September. Boasting a total investment of 20 billion yuan, the project will be implemented in two phases. Upon full completion, it will achieve an annual production capacity of 540,000 wafers, effectively bridging the gap in critical chip supply for China’s automotive, industrial, and other key sectors.
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