Intel Foundry Services and ASML announced that they are accelerating the mass production application of High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography technology. Intel has completed research and development and some mass production stages using early-stage equipment, processing over 1 million wafers. Currently, High-NA EUV technology has been applied to the mass production of certain layers of Intel's Core Ultra 3 series processor, 'Panther Lake.' Intel stated that products manufactured using the 18A process with this technology achieve performance equal to or surpassing that of similar layers produced using traditional 0.33 numerical aperture EUV lithography platforms. In the future, the two companies will also facilitate the transition of mask sizes from 6 inches to 6×12 inches and enable customers to gain some advantages of High-NA EUV under existing conditions through mask stitching technology.