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BOE: Full Automation Equipment Connection Achieved for Panel-Level Glass Substrate Packaging Carrier Test Line
1 day ago /
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Author：小编
BOE A plans to invest RMB 993 million in 2024 for the construction of a panel-level glass substrate packaging carrier test line. The test line is expected to complete the installation and commissioning of main equipment by 2025, with a designed production capacity of 1,000 units per month. Full automation equipment connection will be achieved in the first half of 2026. Currently, the test line has successfully established the entire process flow and possesses comprehensive manufacturing capabilities for glass carriers.
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