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JCET: Intends to Secure Up to 6.5 Billion Yuan via Private Placement to Fund Projects, Including High-Performance Computing Advanced Packaging Platform Expansion
1 day ago /
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Author：小编
JCET has officially declared its intention to raise up to 6.5 billion yuan through a private placement of A-shares. The proceeds from this funding initiative will be earmarked for five key areas: firstly, to facilitate the expansion of the high-performance computing advanced packaging platform; secondly, to enhance the advanced packaging and testing capabilities for high-end power modules; thirdly, to upgrade and expand the capacity of the advanced wafer-level packaging technology platform; fourthly, to bolster the system-level packaging and testing capabilities for high-density, large-capacity memory chips; and lastly, to supplement working capital and settle outstanding bank loans.
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