On September 1, Innolux made a significant announcement, unveiling its inaugural Chip-Last FOPLP (Fan-Out Panel Level Packaging) technology platform. Mass production for this cutting-edge platform is projected to commence in the latter half of 2027. This innovative technology is designed to facilitate high-density heterogeneous integration, utilizing a sophisticated multi-layer RDL (Redistribution Layer) and embedded core architecture. By harnessing a vast 620mm×670mm panel, it achieves an impressive 2μm line width and line spacing, setting a new benchmark in the industry.

Furthermore, Innolux has also engineered an efficient testing solution tailored for Chip-First FOPLP. This solution boasts the capability to test up to 64 new products in a single testing cycle, significantly enhancing testing efficiency by 50% to 80%. In a strategic move to bolster its advanced packaging capabilities, Innolux plans to repurpose its existing TFT display plant, transforming it into a state-of-the-art advanced packaging production line. This transformation will enable Innolux to offer comprehensive one-stop services, streamlining the production process and enhancing customer satisfaction.