Micron plans to double its HBM production capacity, aiming to produce approximately 100,000 wafers per month by the end of this year
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Author:小编   

Micron plans to aggressively invest in equipment before the end of the year, doubling its high-bandwidth memory (HBM) production capacity compared to last year. This move aims to strengthen the supply capability of its next-generation HBM4 12-layer products, address production capacity shortages, increase market share, and compete against Samsung Electronics and SK Hynix.