Montage Technology has unveiled significant advancements in its chip development pipeline. Its CXL3.2 MXC chip, the first to enter trial production in July, has already been embraced by industry leaders such as Samsung and SK Hynix for integration into next-generation CXL products. Analysts predict that CXL technology will witness widespread commercial adoption by 2027.

In parallel, the PCIe Switch chip is on track to complete engineering sample tape-out within this year. Meanwhile, the PCIe6.x/CXL3.x Retimer chip has successfully finalized the tape-out for its mass production variant and has earned a spot on the PCI-SIG supplier list.

This year will also see the completion of engineering sample tape-out for the cutting-edge PCIe7.0 Retimer and Ethernet PHY Retimer chips. In the realm of memory technology, the DDR5 sixth-generation RCD chip has commenced sampling, while the fifth-generation version has already begun mass shipments. Notably, combined shipments of the third and fourth generations now constitute over 50% of the market.

Additionally, the second-generation MRCD/MDB chip is currently undergoing large-scale trial use, with its full-scale production contingent upon the mass rollout of next-generation CPUs in the coming year. The clock chip has secured mass production orders, and the high-precision RTC chip is slated to complete engineering sample tape-out in the latter half of the year.

As AI servers increasingly incorporate higher proportions of CPU configurations, the demand for memory modules and interconnect chips is poised for substantial growth.